Technical parameters/Contact electroplating: | Gold |
|
Encapsulation parameters/installation method: | Solder |
|
Dimensions/Length: | 17.93 mm |
|
Dimensions/Width: | 7.92 mm |
|
Physical parameters/contact material: | Brass |
|
Other/Packaging Methods: | Bulk |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
MC23546
|
Multicomp | 类似代替 |
MULTICOMP MC23546 射频同轴连接器, SMA
|
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