Encapsulation parameters/installation method: | Surface Mount |
|
Package parameters/number of pins: | 165 |
|
Encapsulation parameters/Encapsulation: | BGA |
|
Dimensions/Packaging: | BGA |
|
Other/Product Lifecycle: | Unknown |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
CY7C1414AV18-250BZC
|
Cypress Semiconductor | 功能相似 | FBGA-165 |
36 - Mbit的QDR - II SRAM的2字突发架构 36-Mbit QDR-II SRAM 2-Word Burst Architecture
|
||
CY7C1414JV18-250BZXC
|
Cypress Semiconductor | 功能相似 | FBGA-165 |
36 - Mbit的QDR - II SRAM的2字突发架构 36-Mbit QDR-II SRAM 2-Word Burst Architecture
|
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