Technical parameters/Contact electroplating: | Gold |
|
Technical parameters/Contact resistance: | 1.50 mΩ |
|
Physical parameters/contact material: | Brass |
|
Physical parameters/insulation material: | Teflon |
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Compliant with standards/RoHS standards: | Exempt |
|
Compliant with standards/lead standards: | Lead Free |
|
Compliant with the REACH SVHC standard: | No SVHC |
|
Compliant with standards/military grade: | Yes |
|
Compliant with standard/REACH SVHC version: | 2015/12/17 |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
13-01-3 58U
|
Multicomp | 完全替代 |
MULTICOMP 13-01-3 58U 射频/同轴连接器, BNC同轴, 直型插头, 焊接, 50 ohm, Essex 621715, RG58, 黄铜
|
|||
13-01-3 TGZ RG174U
|
Multicomp | 完全替代 |
MULTICOMP 13-01-3 TGZ RG174U 射频/同轴连接器, BNC同轴, 直型插头, 焊接, 50 ohm, RG174, 黄铜
|
|||
13-06-4 RG179
|
Multicomp | 完全替代 |
MULTICOMP 13-06-4 RG179 射频/同轴连接器, BNC同轴, 直角插头, 焊接, 75 ohm, RG179, 黄铜
|
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