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Description Thermoelectric Cooler Modules, Adaptive The Thermoelectric modules utilise the Peltier phenomenon principle to pump heat when voltage is applied. Effective cooling power from mW to a hundred of Watts Up to 150˚C continuous operation Modules can be bonded using heat sink bonder Applications in refrigeration and power generation Silicone sealed options ### 热电模块 - 珀尔帖效应 一系列以珀尔帖效应原理工作的半导体热电器件。 提供合适的电流时,它们可以冷却或加热。 受外部施加温度梯度下,这些器件将产生少量电能。较大的器件可以用于冷却或控制子组件的温度。 袖珍模块体型小,适合于冷却微型电子部件,如:红外检测芯片、微波集成电路、光纤激光与探测器等。或者,也可以通过温度控制,降低振荡器稳定性、参考电压、放大器偏移等的温度系数效应。 固态长期稳定性 不产生噪声
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347.64  yuan 347.64yuan
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Other/Maximum Cooling Capacity:

20.9W

 

Other/maximum temperature difference:

+74K

 

Other/Maximum Current:

2.2A

 

Other/Maximum Voltage:

15.7V

 

Other/Effective Area:

25 x 25mm

 

Other/Effective Area Length:

25mm

 

Other/Effective Area Thickness:

3.8mm

 

Other/Effective Area Width:

25mm

 

Compliant with standards/RoHS standards:

RoHS Compliant

 

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