Technical parameters/capacitance: | 0.1 µF |
|
Technical parameters/operating temperature (Max): | 125 ℃ |
|
Technical parameters/operating temperature (Min): | -55 ℃ |
|
Encapsulation parameters/installation method: | Surface Mount |
|
Encapsulation parameters/Encapsulation (metric): | 3216 |
|
Encapsulation parameters/Encapsulation: | 1206 |
|
Dimensions/Length: | 3.2 mm |
|
Dimensions/Width: | 1.6 mm |
|
Dimensions/Height: | 1.6 mm |
|
Dimensions/Packaging (Metric): | 3216 |
|
Dimensions/Packaging: | 1206 |
|
Other/Product Lifecycle: | Active |
|
Other/Packaging Methods: | Tape & Reel (TR) |
|
Compliant with standards/RoHS standards: | Non-Compliant |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
1206J2000104KXT
|
Syfer Technology | 完全替代 | 1206 |
Cap,MultiLayer,Ceramic,1206,200VDC,100nF,10%,X7R,Sn
|
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