Technical parameters/capacitance: | 330 nF |
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Technical parameters/tolerances: | ±10 % |
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Technical parameters/operating temperature (Max): | 125 ℃ |
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Technical parameters/operating temperature (Min): | -55 ℃ |
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Encapsulation parameters/installation method: | Surface Mount |
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Encapsulation parameters/Encapsulation (metric): | 3216 |
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Encapsulation parameters/Encapsulation: | 1206 |
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Dimensions/Length: | 3.2 mm |
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Dimensions/Width: | 1.6 mm |
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Dimensions/Height: | 1.6 mm |
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Dimensions/Packaging (Metric): | 3216 |
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Dimensions/Packaging: | 1206 |
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Physical parameters/temperature coefficient: | ±15 % |
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Other/Product Lifecycle: | Active |
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Other/Packaging Methods: | Tape & Reel (TR) |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
CL31B334KBFNNNF
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Samsung | 类似代替 | 1206 |
Samsung 1206 MLCC series Highly reliable tolerance and high speed automatic chip placement on PCBs Wide capacitance range Wide temperature compensation and voltage range: from C0G to Y5V and from 6.3V to 50V Highly reliable performance Highly resistant termination metal Applications include: HHP, DSC, DVC, LCD, TV, Memory Module, PDA, Game Machine; Tuner (Product code C is suitable.) For using special purpose like Military, Medical, Aviation, Automobile device should be following a special specification ### 1206 系列 C0G (NP0) 是温度补偿的最常见配方，为 EIA I 类陶瓷材料 X7R 配方称为温度稳定陶瓷，属于 EIA II 类材料 Y5V 配方为有限温度范围内的一般用途材料。这些特征使得 Y5V 非常适合去耦应用。
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