Technical parameters/number of contacts: | 40 |
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Technical parameters/Contact electroplating: | Gold, Tin |
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Technical parameters/rated voltage (DC): | 50.0 V |
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Technical parameters/rated current: | 3 A |
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Technical parameters/number of rows: | 2 |
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Technical parameters/number of pins: | 40 |
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Technical parameters/installation angle: | 180 ° |
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Technical parameters/rated current (Max): | 3 A |
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Technical parameters/operating temperature (Max): | 125 ℃ |
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Technical parameters/operating temperature (Min): | -55 ℃ |
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Technical parameters/Contact resistance (Max): | 10 mΩ |
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Encapsulation parameters/installation method: | Through Hole |
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Package parameters/number of pins: | 40 |
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Encapsulation parameters/Encapsulation: | DIP |
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Packaging parameters/pin spacing: | 2.54 mm |
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Dimensions/Length: | 50.8 mm |
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Dimensions/Width: | 17.8 mm |
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Dimensions/Height: | 4.19 mm |
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Dimensions/Packaging: | DIP |
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Dimensions/Pin Spacing: | 2.54 mm |
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Physical parameters/contact material: | Beryllium Copper |
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Physical parameters/operating temperature: | -55℃ ~ 125℃ |
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Other/Product Lifecycle: | Active |
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Other/Packaging Methods: | Tube |
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Compliant with standards/RoHS standards: | Non-Compliant |
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Compliant with standards/lead standards: | Contains Lead |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual |
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