Technical parameters/number of contacts: | 8 |
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Technical parameters/polarity: | Male |
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Technical parameters/Contact electroplating: | Gold |
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Technical parameters/number of rows: | 1 |
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Technical parameters/number of pins: | 8 |
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Technical parameters/rated current (Max): | 6.3A/contact |
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Encapsulation parameters/installation method: | Through Hole |
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Packaging parameters/pin spacing: | 2.54 mm |
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Dimensions/Height: | 8.38 mm |
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Dimensions/Pin Spacing: | 2.54 mm |
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Physical parameters/shell color: | Black |
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Physical parameters/contact material: | Phosphor Bronze |
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Physical parameters/operating temperature: | -55℃ ~ 125℃ |
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Other/Product Lifecycle: | Active |
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Other/Packaging Methods: | Bag |
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Other/Manufacturing Applications: | Industrial, - |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | Lead Free |
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Compliant with the REACH SVHC standard: | No SVHC |
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Compliant with standard/REACH SVHC version: | 2015/06/15 |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
75160-118-08LF
|
Amphenol ICC | 功能相似 |
Conn Unshrouded Header HDR 8POS 2.54mm Solder ST Thru-Hole Poly Bag
|
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TSW-108-08-G-S
|
Samtec | 完全替代 | - |
SAMTEC TSW-108-08-G-S 板至板连接, 垂直, TSW系列, 8 触点, 针座, 2.54 mm, 通孔安装, 1 排
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