Technical parameters/Contact electroplating: | Tin Lead |
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Encapsulation parameters/installation method: | Through Hole |
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Dimensions/Length: | 13.97 mm |
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Physical parameters/contact material: | Brass Alloy |
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Other/Product Lifecycle: | Active |
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Other/Packaging Methods: | Bulk |
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Compliant with standards/RoHS standards: | Non-Compliant |
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Compliant with standards/lead standards: | Contains Lead |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
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Mill-Max | 功能相似 | Through Hole |
회로 기판 하드웨어 - PCB 200u SN OVER NI 1 WRAP
|
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