Technical parameters/Contact electroplating: | Gold |
|
Technical parameters/frequency: | 6 GHz |
|
Technical parameters/operating temperature (Max): | 125 ℃ |
|
Technical parameters/operating temperature (Min): | -40 ℃ |
|
Encapsulation parameters/installation method: | Surface Mount |
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Encapsulation parameters/Encapsulation: | SMD |
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Dimensions/Packaging: | SMD |
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Physical parameters/contact material: | Copper Alloy |
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Physical parameters/operating temperature: | -40℃ ~ 125℃ |
|
Other/Product Lifecycle: | Active |
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Other/Packaging Methods: | Tape & Reel (TR) |
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Other/Manufacturing Applications: | RF Communications, Industrial |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | Lead Free |
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Compliant with standards/ELV standards: | Compliant |
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Compliant with the REACH SVHC standard: | No SVHC |
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Customs information/ECCN code: | EAR99 |
|
Customs information/HTS code: | 8536694010 |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
1658260-1
|
TE Connectivity | 完全替代 | SMD |
50 Ohm 板对板 压缩 表面贴装 连接器
|
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