Technical parameters/polarity: | Male |
|
Technical parameters/Contact electroplating: | Gold |
|
Technical parameters/Insulation resistance: | 5000 MΩ |
|
Technical parameters/direction: | Right Angle |
|
Technical parameters/operating temperature (Max): | 125 ℃ |
|
Technical parameters/operating temperature (Min): | -65 ℃ |
|
Encapsulation parameters/installation method: | Through Hole |
|
Dimensions/Height: | 9.52 mm |
|
Physical parameters/contact material: | Beryllium Copper |
|
Physical parameters/medium materials: | Tetrafluoroethylene (TFE) |
|
Physical parameters/operating temperature: | -65℃ ~ 105℃ |
|
Other/Product Lifecycle: | Active |
|
Other/Packaging Methods: | Bulk |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | Contains Lead |
|
Compliant with standards/ELV standards: | Compliant |
|
Customs information/ECCN code: | EAR99 |
|
Customs information/HTS code: | 8536694010 |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
2064-8002-90
|
TE Connectivity | 功能相似 |
Conn SMA RCP 500MHz to 18000MHz 50Ω Solder RA Thru-Hole Gold
|
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