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Model 0805Y2000103KXT
Description Syfer Flexicap 0805 由于听到客户 MLCC 遇到应力损坏的经历，开发了 FlexiCap™ 专有柔性环氧聚合体端接材料，应用于常见镍挡板表面下面的设备 FlexiCap™ 将承受比传统电容器更大的板弯曲度 FlexiCap™ 的另外一个优点是 MLCC 可耐温度循环 -55ºC 至 125ºC 超过 1000 次而不会破裂 可使用您的传统波峰焊或回流焊接技术焊接 FlexiCap™，无需调整到设备或当前工艺 ### 0805 系列 镍挡板终端覆镀锡 (NiSn) 层，应用包括移动电话、视频和调谐器设计，COG/NPO 是“温度补偿”的最常见配方，为 EIA I 类陶瓷材料，X7R、X5R 配方称为“温度稳定”陶瓷，属于 EIA II 类材料，Y5V、Z5U 配方适合有限温度范围内的一般用途，属于 EIA II 类材料；这些特征非常适合退耦应用。Y5V、Z5U 配方适合有限温度范围内的一般用途，属于 EIA II 类材料；这些特征非常适合退耦应用。
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Brand: Syfer Technology
Packaging 0805
Delivery time
Packaging method Tape & Reel (TR)
Standard packaging quantity 1
2.29  yuan 2.29yuan
  • Freight charges：   In stock Freight rate：$13.00
  • Quantity： Inventory(9792) Minimum order quantity(1)
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Technical parameters/capacitance:

10 nF

 

Technical parameters/tolerances:

±10 %

 

Technical parameters/operating temperature (Max):

125 ℃

 

Technical parameters/operating temperature (Min):

-55 ℃

 

Encapsulation parameters/installation method:

Surface Mount

 

Encapsulation parameters/Encapsulation (metric):

2012

 

Encapsulation parameters/Encapsulation:

0805

 

Dimensions/Length:

2 mm

 

Dimensions/Width:

1.25 mm

 

Dimensions/Height:

1.3 mm

 

Dimensions/Packaging (Metric):

2012

 

Dimensions/Packaging:

0805

 

Physical parameters/temperature coefficient:

±15 %

 

Other/Product Lifecycle:

Active

 

Other/Packaging Methods:

Tape & Reel (TR)

 

Compliant with standards/RoHS standards:

RoHS Compliant

 

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Alternative material

Model Brand Similarity Encapsulation Introduction Data manual
0805Y2000103KET 0805Y2000103KET Syfer Technology 类似代替 0805
Ceramic Capacitor, Multilayer, Ceramic, 200V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.01uF, Surface Mount, 0805, CHIP, ROHS COMPLIANT

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