Encapsulation parameters/installation method: | Surface Mount |
|
Encapsulation parameters/Encapsulation (metric): | 1608 |
|
Encapsulation parameters/Encapsulation: | 0603 |
|
Dimensions/Length: | 1.6 mm |
|
Dimensions/Width: | 0.8 mm |
|
Dimensions/Packaging (Metric): | 1608 |
|
Dimensions/Packaging: | 0603 |
|
Other/Product Lifecycle: | Active |
|
Other/Packaging Methods: | Tape & Reel (TR) |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
0603N680F500CT
|
Walsin Technology | 功能相似 | 0603 |
MLCC-多层陶瓷电容器
|
||
CC0603FRNPO9BN680
|
Yageo | 功能相似 | 0603 |
0603 68 pF 50 V ±1 % 容差 NP0 表面贴装 陶瓷电容
|
||
|
|
Vishay Vitramon | 功能相似 | 0603 |
CAPACITOR, CERAMIC, MULTILAYER, 50V, C0G, 0.000068uF, SURFACE MOUNT, 0603, CHIP, ROHS COMPLIANT
|
||
VJ0603A680FXACW1BC
|
VISHAY | 功能相似 | 0603 |
CAPACITOR, CERAMIC, MULTILAYER, 50V, C0G, 0.000068uF, SURFACE MOUNT, 0603, CHIP, ROHS COMPLIANT
|
||
VJ0603A680FXACW1BC
|
Vishay Semiconductor | 功能相似 | 0603 |
CAPACITOR, CERAMIC, MULTILAYER, 50V, C0G, 0.000068uF, SURFACE MOUNT, 0603, CHIP, ROHS COMPLIANT
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review