Technical parameters/Contact electroplating: | Gold, Gold over Nickel |
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Technical parameters/rated current (Max): | 3 A |
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Technical parameters/operating temperature (Max): | 125 ℃ |
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Technical parameters/operating temperature (Min): | -55 ℃ |
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Technical parameters/Contact resistance (Max): | 10 mΩ |
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Encapsulation parameters/installation method: | Solder |
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Dimensions/Length: | 5.97 mm |
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Dimensions/Height: | 1.04 mm |
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External dimensions/inner diameter dimensions: | 559 µm |
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Physical parameters/contact material: | Beryllium Copper |
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Physical parameters/operating temperature: | -55℃ ~ 125℃ |
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Other/Product Lifecycle: | Active |
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Other/Packaging Methods: | Bulk |
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Compliant with standards/RoHS standards: |
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Compliant with standards/lead standards: | Lead Free |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual |
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