Technical parameters/number of contacts: | 26 |
|
Technical parameters/polarity: | Male |
|
Technical parameters/Contact electroplating: | Gold |
|
Technical parameters/rated current: | 3 A |
|
Technical parameters/number of rows: | 2 |
|
Technical parameters/number of pins: | 26 |
|
Technical parameters/rated voltage: | 250 V |
|
Encapsulation parameters/installation method: | Through Hole |
|
Physical parameters/color: | Black |
|
Physical parameters/contact material: | Copper |
|
Physical parameters/operating temperature: | -40℃ ~ 125℃ |
|
Other/Product Lifecycle: | Active |
|
Other/Packaging Methods: | Bulk |
|
Other/Manufacturing Applications: | -, Industrial, Industrial |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
Compliant with standards/lead standards: | Lead Free |
|
Compliant with the REACH SVHC standard: | No SVHC |
|
Compliant with standard/REACH SVHC version: | 2014/06/16 |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
67996-126HLF
|
Future Communications IC | 类似代替 |
AMPHENOL FCI 67996-126HLF 板至板连接器, 公, 26路, 2排
|
|||
67996-126HLF
|
FCI Electronics | 类似代替 |
AMPHENOL FCI 67996-126HLF 板至板连接器, 公, 26路, 2排
|
|||
67996-126HLF
|
Amphenol | 类似代替 | - |
AMPHENOL FCI 67996-126HLF 板至板连接器, 公, 26路, 2排
|
||
TSW-113-07-L-D
|
Samtec | 类似代替 |
SAMTEC TSW-113-07-L-D Board-To-Board Connector, 2.54mm, 26Contacts, Header, TSW Series, Through Hole, 2Rows
|
|||
TSW-113-26-L-D
|
Samtec | 类似代替 |
SAMTEC TSW-113-26-L-D Board-To-Board Connector, 2.54mm, 26Contacts, Header, TSW Series, Through Hole, 2Rows
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review