Chip AI consultant
Technical parameters/output current: | ≤20 mA |
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Technical parameters/power supply current: | 240 μA |
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Technical parameters/number of circuits: | 1 |
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Technical parameters/number of channels: | 1 |
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Technical parameters/dissipated power: | 725 mW |
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Technical parameters/Common Mode Rejection Ratio: | 85dB ~ 110dB |
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Technical parameters/input compensation drift: | 2.00 µV/K |
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Technical parameters/bandwidth: | 1.20 MHz |
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Technical parameters/conversion rate: | 500 mV/μs |
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Technical parameters/gain bandwidth product: | 2 MHz |
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Technical parameters/input compensation voltage: | 120 μV |
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Technical parameters/input bias current: | 25 nA |
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Technical parameters/operating temperature (Max): | 85 ℃ |
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Technical parameters/operating temperature (Min): | -40 ℃ |
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Technical parameters/dissipated power (Max): | 725 mW |
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Technical parameters/Common Mode Rejection Ratio (Min): | 85 dB |
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Technical parameters/power supply voltage (Max): | 40 V |
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Technical parameters/power supply voltage (Min): | 4 V |
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Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 8 |
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Encapsulation parameters/Encapsulation: | SOIC-8 |
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Dimensions/Length: | 4.9 mm |
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Dimensions/Width: | 3.91 mm |
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Dimensions/Height: | 1.58 mm |
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Dimensions/Packaging: | SOIC-8 |
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Physical parameters/operating temperature: | -40℃ ~ 85℃ |
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Other/Product Lifecycle: | Active |
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Other/Packaging Methods: | Tape & Reel (TR) |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
TLE2021MDREP
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TI | 类似代替 | SOIC-8 |
神剑高速低功耗精密运算放大器 EXCALIBUR HIGH-SPEED LOW-POWER PRECISION OPERATIONAL AMPLIFIERS
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