Technical parameters/Contact electroplating: | Gold |
|
Technical parameters/frequency: | 18.0 GHz |
|
Technical parameters/Insulation resistance: | 5000 MΩ |
|
Technical parameters/operating temperature (Max): | 125 ℃ |
|
Technical parameters/operating temperature (Min): | -65 ℃ |
|
Encapsulation parameters/installation method: | Panel |
|
Physical parameters/contact material: | Beryllium Copper |
|
Physical parameters/insulation material: | Teflon |
|
Other/Product Lifecycle: | Unknown |
|
Other/Packaging Methods: | Bulk |
|
Other/Manufacturing Applications: | RF Communications |
|
Compliant with standards/RoHS standards: | Non-Compliant |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
8589-0853
|
Multicomp | 类似代替 |
MULTICOMP 8589-0853 射频/同轴适配器, SMA同轴, 直型隔板安装转接器, SMA, 插座, SMA, 插座
|
|||
901-9209-ASF
|
Amphenol | 功能相似 | SMA |
AMPHENOL RF 901-9209-ASF 射频/同轴适配器, SMA同轴, 直型隔板安装转接器, SMA, 插座, SMA, 插座
|
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