Technical parameters/number of contacts: | 20 |
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Technical parameters/polarity: | Female |
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Technical parameters/Contact electroplating: | Gold |
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Technical parameters/rated current: | 1 A |
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Technical parameters/Insulation resistance: | 1000000 MΩ |
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Technical parameters/number of rows: | 2 |
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Technical parameters/number of pins: | 20 |
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Technical parameters/installation angle: | 180 ° |
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Technical parameters/operating temperature (Max): | 150 ℃ |
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Technical parameters/operating temperature (Min): | -55 ℃ |
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Encapsulation parameters/installation method: | Through Hole |
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Package parameters/number of pins: | 20 |
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Encapsulation parameters/Encapsulation: | SOIC |
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Packaging parameters/pin spacing: | 7.62 mm |
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Dimensions/Length: | 14.5 mm |
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Dimensions/Width: | 40.4 mm |
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Dimensions/Height: | 16.3 mm |
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Dimensions/Packaging: | SOIC |
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Dimensions/Pin Spacing: | 7.62 mm |
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Physical parameters/contact material: | Beryllium Copper |
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Physical parameters/operating temperature: | -55℃ ~ 150℃ |
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Other/Product Lifecycle: | Active |
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Other/Packaging Methods: | Bulk |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | Lead Free |
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Compliant with the REACH SVHC standard: | No SVHC |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual |
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