Technical parameters/Contact electroplating: | Gold |
|
Encapsulation parameters/installation method: | Through Hole |
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Physical parameters/contact material: | Beryllium Copper |
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Compliant with standards/RoHS standards: | Exempt |
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Compliant with standard/REACH SVHC version: | 2015/06/15 |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
73366-0061
|
Molex | 类似代替 |
MOLEX 73366-0061 射频/同轴连接器, MCX同轴, 直型插座, 通孔安装 垂直, 50 ohm, 铍铜
|
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