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Description MOLEX 90120-0784 线至板连接器, 垂直, C-Grid III 90120系列, 24 触点, 针座, 2.54 mm, 通孔安装, 1 排
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Brand: Molex
Packaging Through Hole
Delivery time
Packaging method
Standard packaging quantity 1
24.98  yuan 24.98yuan
  • Freight charges   In stock Freight rate:$13.00
  • Quantity
    Inventory(2916) Minimum order quantity(1)
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Technical parameters/number of contacts:

24

 

Technical parameters/polarity:

Male

 

Technical parameters/Contact electroplating:

Gold, Gold over Nickel

 

Technical parameters/rated voltage (AC):

350 V

 

Technical parameters/rated current:

3 A

 

Technical parameters/Insulation resistance:

5.00 GΩ

 

Technical parameters/number of rows:

1

 

Technical parameters/hot wire testing standards:

Non-Compliant

 

Technical parameters/halogen-free state:

Not Reviewed

 

Technical parameters/direction:

Vertical

 

Technical parameters/number of circuits:

22

 

Technical parameters/Contact resistance:

20.0 mΩ

 

Technical parameters/rated voltage:

350 V

 

Encapsulation parameters/installation method:

Through Hole

 

Packaging parameters/pin spacing:

2.54 mm

 

Dimensions/Length:

60.96 mm

 

Dimensions/Width:

2.54 mm

 

Dimensions/Height:

5.4 mm

 

Dimensions/Pin Spacing:

2.54 mm

 

Physical parameters/contact material:

Copper

 

Physical parameters/materials:

Polyester

 

Other/Product Lifecycle:

Unknown

 

Other/Manufacturing Applications:

Sensing and Instrumentation, Commercial, Automotive, Industrial, Sensing& Instrumentation, Consumer Electronics, Commercial, Automotive

 

Compliant with standards/RoHS standards:

RoHS Compliant

 

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Alternative material

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61302411121 61302411121 Wurth Electronics 功能相似 Through Hole
WURTH ELEKTRONIK 61302411121 板至板连接, 垂直, WR-PHD系列, 24 触点, 针座, 2.54 mm, 通孔安装, 1 排
PDF
HTSW-124-24-G-S HTSW-124-24-G-S Samtec 功能相似
SAMTEC HTSW-124-24G-S Board-To-Board Connector, 2.54mm, 24Contacts, Header, HTSW Series, Through Hole, 1Rows
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