Encapsulation parameters/installation method: | Surface Mount |
|
Package parameters/number of pins: | 8 |
|
Encapsulation parameters/Encapsulation: | MSOP |
|
Dimensions/Packaging: | MSOP |
|
Other/Product Lifecycle: | Obsolete |
|
Other/Packaging Methods: | Tape |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
Compliant with standards/lead standards: | Lead Free |
|
Customs Information/Hong Kong Import and Export License: | NLR |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
LM75ADP,118
|
NXP | 功能相似 | TSSOP-8 |
NXP LM75ADP,118 温度传感器芯片, 数字式, ± 3°C, -55 °C, +125 °C, TSSOP, 8 引脚
|
||
LM75ADP,118
|
NXP | 功能相似 | TSSOP-8 |
NXP LM75ADP,118 温度传感器芯片, 数字式, ± 3°C, -55 °C, +125 °C, TSSOP, 8 引脚
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review