Chip AI consultant
Technical parameters/power supply current: | 116 µA |
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Technical parameters/number of circuits: | 1 |
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Technical parameters/number of channels: | 1 |
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Technical parameters/Common Mode Rejection Ratio: | 4 dB |
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Technical parameters/input compensation drift: | 5.50 µV/K |
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Technical parameters/bandwidth: | 1.5 MHz |
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Technical parameters/conversion rate: | 350 mV/μs |
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Technical parameters/gain bandwidth product: | 1.5 MHz |
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Technical parameters/input compensation voltage: | 1 mV |
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Technical parameters/input bias current: | 15 nA |
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Technical parameters/operating temperature (Max): | 125 ℃ |
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Technical parameters/operating temperature (Min): | -40 ℃ |
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Technical parameters/gain bandwidth: | 1.5 MHz |
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Technical parameters/power supply voltage: | 1.8V ~ 5V |
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Technical parameters/power supply voltage (Max): | 5 V |
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Technical parameters/power supply voltage (Min): | 1.8 V |
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Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 8 |
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Encapsulation parameters/Encapsulation: | QFN-8 |
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Dimensions/Length: | 0.37 mm |
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Dimensions/Width: | 1.5 mm |
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Dimensions/Height: | 0.37 mm |
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Dimensions/Packaging: | QFN-8 |
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Physical parameters/operating temperature: | -40℃ ~ 125℃ |
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Other/Product Lifecycle: | Obsolete |
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Other/Packaging Methods: | Tape & Reel (TR) |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | Contains Lead |
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Compliant with standard/REACH SVHC version: | 2015/06/15 |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual |
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