Encapsulation parameters/installation method: | Surface Mount |
|
Package parameters/number of pins: | 60 |
|
Encapsulation parameters/Encapsulation: | FBGA |
|
Dimensions/Packaging: | FBGA |
|
Other/Product Lifecycle: | Unknown |
|
Other/Packaging Methods: | Tape & Reel (TR) |
|
Compliant with standards/RoHS standards: | Non-Compliant |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
LMX9830SM/NOPB
|
National Semiconductor | 功能相似 | FBGA-60 |
无线收发芯片 LMX9830SM/NOPB NFBGA-60
|
||
LMX9830SM/NOPB
|
National Semiconductor | 功能相似 | FBGA-60 |
无线收发芯片 LMX9830SM/NOPB NFBGA-60
|
||
|
|
National | 功能相似 |
Bluetooth Class II 2.75V 0.704Mbps 60Pin FBGA T/R
|
|||
LMX9830SMX
|
TI | 功能相似 | FBGA |
Bluetooth Class II 2.75V 0.704Mbps 60Pin FBGA T/R
|
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