Chip AI consultant
Technical parameters/rated power: | 40 mW |
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Technical parameters/forward voltage: | 2.05 V |
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Technical parameters/wavelength: | 572 nm |
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Technical parameters/luminous intensity: | 10.2 mcd |
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Technical parameters/perspective: | 130° |
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Technical parameters/lens style: | Diffused |
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Technical parameters/peak wavelength: | 575 nm |
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Technical parameters/test current: | 10 mA |
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Technical parameters/forward current: | 10 mA |
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Technical parameters/forward voltage (Max): | 2.5 V |
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Technical parameters/forward current (Max): | 10 mA |
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Technical parameters/operating temperature (Max): | 85 ℃ |
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Technical parameters/operating temperature (Min): | -30 ℃ |
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Technical parameters/dissipated power (Max): | 40 mW |
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Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 2 |
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Encapsulation parameters/Encapsulation (metric): | 1608 |
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Encapsulation parameters/Encapsulation: | 0603 |
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Dimensions/Length: | 1.6 mm |
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Dimensions/Width: | 0.8 mm |
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Dimensions/Height: | 0.42 mm |
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Dimensions/Packaging (Metric): | 1608 |
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Dimensions/Packaging: | 0603 |
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Physical parameters/color: | Green |
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Physical parameters/operating temperature: | -30℃ ~ 85℃ |
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Other/Product Lifecycle: | Unknown |
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Other/Packaging Methods: | Each |
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Other/Manufacturing Applications: | Consumer Electronics, Consumer electronics products |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | Lead Free |
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual |
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