Encapsulation parameters/installation method: | Surface Mount |
|
Package parameters/number of pins: | 8 |
|
Encapsulation parameters/Encapsulation: | SOIC |
|
Dimensions/Packaging: | SOIC |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
National Semiconductor | 功能相似 | SOIC-8 |
IC REG LDO 2.5V 0.2A 8SOIC
|
||
LP2988IM-2.5
|
TI | 功能相似 | SOIC-8 |
IC REG LDO 2.5V 0.2A 8SOIC
|
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