Encapsulation parameters/installation method: | Surface Mount |
|
Encapsulation parameters/Encapsulation: | MicroSMD-5 |
|
Dimensions/Packaging: | MicroSMD-5 |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
Compliant with standards/lead standards: | Lead Free |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
LP3995ITLX-2.5/NOPB
|
TI | 类似代替 | WFBGA-5 |
线性稳压器(LDO) LP3995ITLX-2.5/NOPB DSBGA-5(1.2x1.5)
|
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