Chip AI consultant
Technical parameters/frequency: | 180 MHz |
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Technical parameters/power supply voltage (DC): | 2.20V (min) |
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Technical parameters/number of pins: | 256 |
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Technical parameters/clock frequency: | 180 MHz |
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Technical parameters/RAM size: | 200 KB |
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Technical parameters/digits: | 32 |
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Technical parameters/dissipated power: | 1500 mW |
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Technical parameters/Analog to Digital Conversion (ADC): | 2 |
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Technical parameters/number of inputs/outputs: | 164 Input |
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Technical parameters/operating temperature (Max): | 85 ℃ |
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Technical parameters/operating temperature (Min): | -40 ℃ |
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Technical parameters/dissipated power (Max): | 1500 mW |
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Technical parameters/Digital to Analog Conversion (DAC): | 1 |
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Technical parameters/power supply voltage (Max): | 3.6 V |
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Technical parameters/power supply voltage (Min): | 2.2 V |
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Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 256 |
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Encapsulation parameters/Encapsulation: | LBGA-256 |
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Dimensions/Length: | 17.2 mm |
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Dimensions/Width: | 17.2 mm |
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Dimensions/Height: | 1.1 mm |
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Dimensions/Packaging: | LBGA-256 |
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Physical parameters/operating temperature: | -40℃ ~ 85℃ |
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Other/Product Lifecycle: | Active |
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Other/Packaging Methods: | Tray |
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Other/Manufacturing Applications: | RF Communications, Metrology, Logistics, Consumer Electronics, RF Communications, Metering, Logistics, Consumer Electronics, Industrial, Industrial |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | Lead Free |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual |
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