Encapsulation parameters/installation method: | Surface Mount |
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Encapsulation parameters/Encapsulation: | SOIC-16 |
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Dimensions/Packaging: | SOIC-16 |
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Other/Case/Package: | 16-SOIC |
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Other/소イ당비プ개수: | 12 |
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Other/소イ개수: | 1 |
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Other: | 네가티브 에지 |
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Other/작동온도: | -40°C ~ 85°C |
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Other/⊙셋: | 비동기 |
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Other/실동형: | 표면실장(SMD, SMT) |
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Other/계수율: | 50MHz |
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Other/논イ형: | 이진 카운터 |
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Other/계 New: | 4000B |
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Other/방향: | 상향 |
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Other/Background - 공급: | 4.5 V ~ 15.5 V |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual |
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