Encapsulation parameters/Encapsulation: | DIP |
|
Dimensions/Packaging: | DIP |
|
Other/Product Lifecycle: | Unknown |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
Compliant with standards/lead standards: | Lead Free |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
DG509ACJ+
|
Maxim Integrated | 类似代替 | DIP-16 |
MAXIM INTEGRATED PRODUCTS DG509ACJ+ 芯片, 模拟多路复用器, 双路, 4:1, DIP-16
|
||
HI3-0509A-5Z
|
Intersil | 完全替代 | DIP-16 |
INTERSIL HI3-0509A-5Z 芯片, 多路复用器, CMOS
|
||
HI3-0509A-5Z
|
Renesas Electronics | 完全替代 | DIP-16 |
INTERSIL HI3-0509A-5Z 芯片, 多路复用器, CMOS
|
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