Technical parameters/RAM size: | 64 KB |
|
Technical parameters/FLASH memory capacity: | 128 KB |
|
Technical parameters/operating temperature (Max): | 85 ℃ |
|
Technical parameters/operating temperature (Min): | 0 ℃ |
|
Encapsulation parameters/installation method: | Surface Mount |
|
Package parameters/number of pins: | 484 |
|
Encapsulation parameters/Encapsulation: | BGA-484 |
|
Dimensions/Packaging: | BGA-484 |
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Physical parameters/operating temperature: | 0℃ ~ 85℃ (TJ) |
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Other/Product Lifecycle: | Active |
|
Other/Packaging Methods: | Tray |
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Compliant with standards/RoHS standards: | Non-Compliant |
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Compliant with standards/lead standards: | Contains Lead |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
M2S005-FGG484
|
Microsemi | 完全替代 | FPBGA-484 |
Field Programmable Gate Array, 6060-Cell, CMOS, PBGA484, 23 X 23MM, 1MM PITCH, ROHS COMPLIANT, FBGA-484
|
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