Technical parameters/RAM size: | 64 KB |
|
Technical parameters/FLASH memory capacity: | 512 KB |
|
Encapsulation parameters/installation method: | Surface Mount |
|
Package parameters/number of pins: | 484 |
|
Encapsulation parameters/Encapsulation: | BGA-484 |
|
Dimensions/Packaging: | BGA-484 |
|
Physical parameters/operating temperature: | 0℃ ~ 85℃ (TJ) |
|
Other/Product Lifecycle: | Active |
|
Other/Packaging Methods: | Tray |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
Compliant with standards/lead standards: | Lead Free |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
M2S090T-FGG484
|
Microsemi | 完全替代 | BGA-484 |
FPGA - 现场可编程门阵列 SmartFusion2
|
||
M2S090T-FGG484
|
SOC | 完全替代 | BGA-484 |
FPGA - 现场可编程门阵列 SmartFusion2
|
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