Encapsulation parameters/installation method: | Through Hole |
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Physical parameters/medium materials: | Tantalum |
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Other/Product Lifecycle: | Active |
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Compliant with standards/RoHS standards: |
| |
Compliant with standards/lead standards: | Contains Lead |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Cornell Dubilier Electronics | 完全替代 |
Cap Tant Solid 3.3uF 15V 20% (3.43 X 7.26mm) Axial (0.1%FR)
|
|||
|
|
KEMET Corporation | 完全替代 |
Cap Tant Solid 3.3uF 15V 20% (3.43 X 7.26mm) Axial (0.1%FR)
|
|||
M39003/01-6049
|
VISHAY | 完全替代 | Axial |
Cap Tant Solid 3.3uF 15V 20% (3.43 X 7.26mm) Axial (0.1%FR) 125℃
|
||
|
|
KEMET Corporation | 完全替代 |
Cap Tant Solid 3.3uF 15V 20% (3.43 X 7.26mm) Axial (0.1%FR) 125℃
|
|||
M39003/01-8049
|
Vishay Semiconductor | 完全替代 | Through Hole |
Cap Tant Solid 3.3uF 15V 20% (3.43 X 7.26mm) Axial (0.001%FR)
|
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