Technical parameters/number of circuits: | 1 |
|
Technical parameters/dissipated power: | 315 mW |
|
Technical parameters/operating temperature (Max): | 85 ℃ |
|
Technical parameters/operating temperature (Min): | -40 ℃ |
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Technical parameters/dissipated power (Max): | 315 mW |
|
Encapsulation parameters/installation method: | Surface Mount |
|
Package parameters/number of pins: | 16 |
|
Encapsulation parameters/Encapsulation: | VFCQFN-16 |
|
Dimensions/Packaging: | VFCQFN-16 |
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Physical parameters/operating temperature: | -40℃ ~ 85℃ |
|
Other/Product Lifecycle: | Active |
|
Other/Packaging Methods: | Tape & Reel (TR) |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | Contains Lead |
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Customs information/ECCN code: | EAR99 |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Imagecraft | 类似代替 |
IC CLOCK BUFFER 1:2 16SMT
|
|||
HMC850LC3
|
ADI | 类似代替 | QFN-16 |
IC CLOCK BUFFER 1:2 16SMT
|
||
HMC850LC3TR
|
ADI | 完全替代 | VFCQFN-16 |
Ic Clock Buffer 1: 2 16smt
|
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