Encapsulation parameters/installation method: | Through Hole |
|
Physical parameters/medium materials: | Tantalum |
|
Other/Product Lifecycle: | Active |
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Compliant with standards/RoHS standards: |
| |
Compliant with standards/lead standards: | Contains Lead |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Cornell Dubilier Electronics | 完全替代 |
Cap Tant Solid 15uF 50V 20% (7.34 X 17.42mm) Axial (1%FR)
|
|||
M39003/01-2378
|
Vishay Semiconductor | 完全替代 | Through Hole |
Cap Tant Solid 15uF 50V 20% (7.34 X 17.42mm) Axial (1%FR)
|
||
M39003/01-2618
|
Vishay Semiconductor | 完全替代 | Through Hole |
Cap Tant Solid 15uF 50V 20% (7.34 X 17.42mm) Axial (0.1%FR)
|
||
|
|
Cornell Dubilier Electronics | 完全替代 |
Cap Tant Solid 15uF 50V 20% (7.34 X 17.42mm) Axial (0.1%FR)
|
|||
|
|
Cornell Dubilier Electronics | 完全替代 |
Cap Tant Solid 15uF 50V 20% (7.34 X 17.42mm) Axial (0.01%FR)
|
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