Encapsulation parameters/installation method: | Through Hole |
|
Physical parameters/medium materials: | Tantalum |
|
Other/Product Lifecycle: | Active |
|
Other/Packaging Methods: | Bulk |
|
Compliant with standards/RoHS standards: | Non-Compliant |
|
Compliant with standards/lead standards: | Contains Lead |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
M39006/25-0155
|
Vishay Semiconductor | 完全替代 | Through Hole |
Cap Tant Wet 82uF 75V 20% (7.92 X 17.88mm) Axial (0.1%FR) 125℃
|
||
M39006/25-0155
|
AVX | 完全替代 | Through Hole |
Cap Tant Wet 82uF 75V 20% (7.92 X 17.88mm) Axial (0.1%FR) 125℃
|
||
M39006/25-0155
|
VISHAY | 完全替代 |
Cap Tant Wet 82uF 75V 20% (7.92 X 17.88mm) Axial (0.1%FR) 125℃
|
|||
M39006/25-0156
|
Vishay Semiconductor | 功能相似 | Through Hole |
VISHAY M39006/25-0156 钽电容, 82uF, 75V, 轴向引线
|
||
M39006/25-0156
|
VISHAY | 功能相似 | Axial |
VISHAY M39006/25-0156 钽电容, 82uF, 75V, 轴向引线
|
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