Chip AI consultant
Technical parameters/number of contacts: | 3 |
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Technical parameters/polarity: | Male |
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Technical parameters/Contact electroplating: | Gold |
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Technical parameters/number of rows: | 1 |
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Technical parameters/rated current (Max): | 5A/contact |
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Technical parameters/operating temperature (Max): | 125 ℃ |
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Technical parameters/operating temperature (Min): | -55 ℃ |
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Technical parameters/Contact resistance (Max): | 10 mΩ |
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Encapsulation parameters/installation method: | Through Hole |
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Dimensions/Height: | 2.48 mm |
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Physical parameters/contact material: | Phosphor Bronze |
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Other/Product Lifecycle: | Active |
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Other/Packaging Methods: | Bulk |
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Other/Manufacturing Applications: | Industrial |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | Lead Free |
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Compliant with the REACH SVHC standard: | No SVHC |
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Compliant with standard/REACH SVHC version: | 2015/06/15 |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
HTMS-103-01-G-S-RA
|
Samtec | 完全替代 | Through Hole |
SAMTEC HTMS-103-01-G-S-RA Board-To-Board Connector, 1.27mm, 3Contacts, Header, HTMS Series, Through Hole, 1Rows
|
||
TMS-103-01-G-S
|
Samtec | 完全替代 | - |
板至板连接, 1.27 mm, 3 触点, 针座, TMS Series, 通孔安装, 1 排
|
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