Chip AI consultant
Technical parameters/number of contacts: | 40 |
|
Technical parameters/rated current: | 1 A |
|
Technical parameters/number of rows: | 1 |
|
Technical parameters/rated current (Max): | 5A/contact |
|
Technical parameters/operating temperature (Max): | 125 ℃ |
|
Technical parameters/operating temperature (Min): | -55 ℃ |
|
Technical parameters/Contact resistance (Max): | 10 mΩ |
|
Encapsulation parameters/installation method: | Through Hole |
|
Encapsulation parameters/Encapsulation: | - |
|
Dimensions/Height: | 8.38 mm |
|
Dimensions/Packaging: | - |
|
Physical parameters/contact material: | Phosphor Copper |
|
Other/Product Lifecycle: | Active |
|
Other/Packaging Methods: | Tube |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
Compliant with standards/lead standards: | Lead Free |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
HTMS-140-01-G-S
|
Samtec | 完全替代 |
SAMTEC HTMS-140-01-G-S Board-To-Board Connector, 1.27mm, 40Contacts, Header, HTMS Series, Through Hole, 1Rows
|
|||
TMS-140-01-G-S
|
Samtec | 完全替代 |
SAMTEC TMS-140-01-G-S Board-To-Board Connector, 1.27mm, 40Contacts, Header, TMS Series, Through Hole, 1Rows
|
|||
TMS-140-01-S-S-RA
|
Samtec | 完全替代 |
针座 - TMS 系列 直向或 90° 公针座条，其节距为 1.27mm，用于焊接至印刷电路板 10 或 40 路的单排或双排 适用于板对板连接，并且可以切割为各种尺寸 额定电流 1A 工作温度 -65 至 105°C A = 11.43mm、B = 5.84mm、C = 3.05mm 90° B = 5.84mm ### 1.27mm 板到板和线对板 Samtec
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review