Chip AI consultant
Technical parameters/capacitance: | 1.5 µF |
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Physical parameters/operating temperature: | -55℃ ~ 85℃ |
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Other/Dielectric: | X5R |
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Other/Counting: | Through Hole |
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Other/Construction: | Radial |
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Other/Package/Case: | 4.5(Max) X 2.5(Max) X 5.5(Max) |
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Other/Lead Finish: | Tin|Copper |
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Other/Max Processing Temps: | 250 |
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Other/Lead Diameter: | 0.5 mm |
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Other/Capacity Value: | 1.5 uF |
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Other/Wire Forms: | Inside Bend |
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Other/Operating Temperature: | -55 to 85 °C |
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Other/Determination Styles: | Radial |
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Other/Tolerance: | 10 % |
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Other/Lead Pitch For Radial: | 2.5 mm |
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Other/Case Style: | Dipped |
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Other/Voltage (DC): | 10 V |
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Other/Product Length: | 4.5(Max) mm |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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