Technical parameters/rise/fall time: | 100µs, 20µs |
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Technical parameters/Input voltage (DC): | 1.20 V |
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Technical parameters/output voltage: | 300 V |
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Technical parameters/number of circuits: | 1 |
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Technical parameters/number of channels: | 1 |
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Technical parameters/number of pins: | 4 |
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Technical parameters/forward voltage: | 1.2 V |
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Technical parameters/input current: | 10 mA |
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Technical parameters/dissipated power: | 150 mW |
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Technical parameters/rise time: | 100 µs |
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Technical parameters/isolation voltage: | 5000 Vrms |
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Technical parameters/forward current: | 50 mA |
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Technical parameters/output voltage (Max): | 300 V |
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Technical parameters/input current (Min): | 50 mA |
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Technical parameters/breakdown voltage: | 6 V |
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Technical parameters/forward voltage (Max): | 1.4 V |
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Technical parameters/forward current (Max): | 50 mA |
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Technical parameters/descent time: | 100 µs |
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Technical parameters/descent time (Max): | 100 µs |
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Technical parameters/rise time (Max): | 300 µs |
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Technical parameters/operating temperature (Max): | 100 ℃ |
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Technical parameters/operating temperature (Min): | -30 ℃ |
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Technical parameters/dissipated power (Max): | 150 mW |
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Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 4 |
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Encapsulation parameters/Encapsulation: | DIP-4 |
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Dimensions/Length: | 7 mm |
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Dimensions/Width: | 5.1 mm |
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Dimensions/Height: | 4 mm |
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Dimensions/Packaging: | DIP-4 |
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