Encapsulation parameters/installation method: | Through Hole |
|
Encapsulation parameters/Encapsulation: | DIP |
|
Dimensions/Packaging: | DIP |
|
Other/Product Lifecycle: | Unknown |
|
Other/Packaging Methods: | Tube |
|
Compliant with standards/RoHS standards: | Non-Compliant |
|
Compliant with standards/lead standards: | Contains Lead |
|
Customs information/ECCN code: | EAR99 |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
IDT7201LA25SO8
|
Integrated Device Technology | 功能相似 | SOIC-28 |
IC MEM FIFO 512X9 25NS 28-SOIC
|
||
IDT7201LA25TP
|
Integrated Device Technology | 功能相似 | DIP-28 |
CMOS异步FIFO 256 ×9 , 512× 9 , 1K ×9 CMOS ASYNCHRONOUS FIFO 256 x 9, 512 x 9, 1K x 9
|
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