Encapsulation parameters/installation method: | Surface Mount |
|
Encapsulation parameters/Encapsulation: | LQFP |
|
Dimensions/Packaging: | LQFP |
|
Other/Product Lifecycle: | Unknown |
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Other/Packaging Methods: | Tape & Reel (TR) |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | Lead Free |
|
Customs information/ECCN code: | EAR99 |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
72V36100L15PFI
|
Integrated Device Technology | 功能相似 | TQFP-128 |
FIFO Mem Sync Dual Depth/Width Uni-Dir 64K x 36 128Pin TQFP
|
||
|
|
Integrated Device Technology | 功能相似 | LQFP-128 |
IC FIFO 64X36 6NS 128QFP
|
||
IDT72V36104L15PF
|
Integrated Device Technology | 功能相似 | LQFP-128 |
3.3伏的CMOS SyncBiFIFOTM具有总线匹配 3.3 VOLT CMOS SyncBiFIFOTM WITH BUS-MATCHING
|
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