Technical parameters/digital logic level: | SAR |
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Technical parameters/digits: | 10 |
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Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 28 |
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Encapsulation parameters/Encapsulation: | HVQCCN |
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Dimensions/Packaging: | HVQCCN |
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Other/Product Lifecycle: | Unknown |
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Other/Packaging Methods: | Tape, Tape & Reel (TR) |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | Lead Free |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Maxim Integrated | 完全替代 | HVQCCN |
10位高达300ksps ADC,带有FIFO ,温度传感器,内部参考 10-Bit 300ksps ADCs with FIFO, Temp Sensor, Internal Reference
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