Encapsulation parameters/installation method: | Surface Mount |
|
Encapsulation parameters/Encapsulation: | SOIC-8 |
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Dimensions/Packaging: | SOIC-8 |
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Other/Product Lifecycle: | Unknown |
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Compliant with standards/RoHS standards: | Non-Compliant |
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Compliant with standards/lead standards: | Contains Lead |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
MAX543ACPA+
|
Dallas Semiconductor | 功能相似 |
MAXIM INTEGRATED PRODUCTS MAX543ACPA+ 数模转换器, 精准, 12 bit, 串行, 4.75V 至 5.25V, 11.4V 至 15.75V, DIP, 8 引脚
|
|||
MAX543ACSA+
|
Maxim Integrated | 功能相似 | SOIC-8 |
MAXIM INTEGRATED PRODUCTS MAX543ACSA+ 数模转换器, 精准, 12 bit, 串行, 4.75V 至 5.25V, 11.4V 至 15.75V, NSOIC, 8 引脚
|
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