Encapsulation parameters/installation method: | Surface Mount |
|
Package parameters/number of pins: | 8 |
|
Encapsulation parameters/Encapsulation: | SOIC-8 |
|
Dimensions/Packaging: | SOIC-8 |
|
Other/Product Lifecycle: | Unknown |
|
Other/Packaging Methods: | Tape & Reel (TR) |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
Compliant with standards/lead standards: | Lead Free |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
MAX662ACSA+
|
Maxim Integrated | 功能相似 | SOIC-8 |
MAXIM INTEGRATED PRODUCTS MAX662ACSA+ 芯片, 电压转换器, SMD, SOIC8, 662 新
|
||
MAX662AESA+
|
Dallas Semiconductor | 功能相似 |
MAXIM INTEGRATED PRODUCTS MAX662AESA+. 芯片, 稳压器
|
|||
MAX662AESA+
|
Maxim Integrated | 功能相似 | SOIC-8 |
MAXIM INTEGRATED PRODUCTS MAX662AESA+. 芯片, 稳压器
|
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