Encapsulation parameters/installation method: | Through Hole |
|
Package parameters/number of pins: | 16 |
|
Encapsulation parameters/Encapsulation: | DIP |
|
Dimensions/Packaging: | DIP |
|
Other/Product Lifecycle: | Unknown |
|
Other/Packaging Methods: | Bulk |
|
Compliant with standards/RoHS standards: | Non-Compliant |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
MAX693CPE+
|
Dallas Semiconductor | 功能相似 |
MAXIM INTEGRATED PRODUCTS MAX693CPE+ 芯片, 微处理器监控器, 5.5V, DIP-16
|
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