Chip AI consultant
Technical parameters/digits: | 8 |
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Technical parameters/access time (Max): | 0.45 ns |
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Technical parameters/operating temperature (Max): | 85 ℃ |
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Technical parameters/operating temperature (Min): | 40 ℃ |
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Technical parameters/power supply voltage: | 1.7V ~ 1.9V |
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Technical parameters/power supply voltage (Max): | 1.9 V |
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Technical parameters/power supply voltage (Min): | 1.7 V |
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Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 60 |
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Encapsulation parameters/Encapsulation: | BGA-60 |
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Dimensions/Packaging: | BGA-60 |
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Physical parameters/operating temperature: | -40℃ ~ 85℃ (TA) |
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Other/Product Lifecycle: | Obsolete |
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Other/Packaging Methods: | Tray |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | lead-free |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
IS43DR81280B-3DBLI
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Integrated Silicon Solution | 类似代替 | BGA-60 |
动态随机存取存储器 1G (128Mx8) 333MHz 1.8v DDR2 S动态随机存取存储器
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