Encapsulation parameters/installation method: | Surface Mount |
|
Package parameters/number of pins: | 20 |
|
Encapsulation parameters/Encapsulation: | SOIC |
|
Dimensions/Packaging: | SOIC |
|
Other/Product Lifecycle: | Unknown |
|
Other/Packaging Methods: | Tape & Reel (TR) |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
Compliant with standards/lead standards: | Contains Lead |
|
Customs information/ECCN code: | EAR99 |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Freescale | 功能相似 | SOIC |
5V ECL双1 : 3扇出缓冲器 5V ECL Dual 1:3 Fanout Buffer
|
||
MC100EL13DW
|
ON Semiconductor | 功能相似 | SOIC-20 |
5V ECL双1 : 3扇出缓冲器 5V ECL Dual 1:3 Fanout Buffer
|
||
MC100EL13DWG
|
ON Semiconductor | 功能相似 | SOIC-20 |
5V ECL双1 : 3扇出缓冲器 5V ECL Dual 1:3 Fanout Buffer
|
||
|
|
Freescale | 功能相似 | SOIC |
5V ECL双1 : 3扇出缓冲器 5V ECL Dual 1:3 Fanout Buffer
|
||
|
|
NXP | 功能相似 | SOIC |
5V ECL双1 : 3扇出缓冲器 5V ECL Dual 1:3 Fanout Buffer
|
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