Encapsulation parameters/installation method: | Surface Mount |
|
Package parameters/number of pins: | 8 |
|
Encapsulation parameters/Encapsulation: | TSSOP |
|
Dimensions/Packaging: | TSSOP |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
MC100LVEL16DG
|
ONA | 功能相似 |
ON SEMICONDUCTOR MC100LVEL16DG 芯片, ECL 100 逻辑器件
|
|||
MC100LVEL16DG
|
ON Semiconductor | 功能相似 | SOIC-8 |
ON SEMICONDUCTOR MC100LVEL16DG 芯片, ECL 100 逻辑器件
|
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