Encapsulation parameters/installation method: | Surface Mount |
|
Package parameters/number of pins: | 16 |
|
Encapsulation parameters/Encapsulation: | TSSOP |
|
Dimensions/Packaging: | TSSOP |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Freescale | 类似代替 | TSSOP |
3.3V ECL ÷ 2 ÷ 4 ÷ 8时钟发生器芯片 3.3V ECL ±2, ±4, ±8 Clock Generation Chip
|
||
MC100LVEL34DTR2G
|
ON Semiconductor | 完全替代 | TSSOP-16 |
3.3V ECL ÷ 2 ÷ 4 ÷ 8时钟发生器芯片 3.3V ECL ±2, ±4, ±8 Clock Generation Chip
|
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