Encapsulation parameters/installation method: | Surface Mount |
|
Package parameters/number of pins: | 8 |
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Encapsulation parameters/Encapsulation: | TSSOP |
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Dimensions/Packaging: | TSSOP |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Freescale | 完全替代 | SOIC |
3.3V ECL ÷4 除法器
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|
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Freescale | 完全替代 | TSSOP |
MC100LVEL33 系列 4 GHz 3.8 V 表面贴装 ECL 4分频器 - TSSOP-8
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